Description
1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
₹3,166.00
1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
Weight | 2.012 kg |
---|---|
Dimensions | 25.0 × 20.0 × 15.0 cm |
SKU | SP1985A, SP1985B |
Option | Kaisi K-816 US Plug, Kaisi K-816 EU Plug, Kaisi K-812 US Plug, Kaisi K-812 EU Plug, Kaisi 818 US Plug, Kaisi 818 EU Plug |
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