Description
1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding
2. Good toughness
3. High temperature resistance
4. 0.12mm, make phone repairs easier, make reballing work easier.
5. Heated anti-drum design
Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max
₹684.00
Additional information
| Weight | 0.042 kg |
|---|---|
| Dimensions | 19.0 × 10.0 × 1.0 cm |
| SKU | |
| Option | Mijing iPH-13, Mijing iPH-15, Mijing A14 |
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